Job Description

We are seeking a highly experienced ASIC Technical Program Manager with deep expertise in Analog Mixed-Signal (AMS) ASIC developments. This role will lead complex semiconductor development programs from specification through to production, while managing global teams, executive stakeholders, and customer relationships using data-driven methodologies.

Key Responsibilities

• Lead full lifecycle execution of AMS-intensive ASIC programs, including PMIC integration, from specification definition to part delivery .
• Drive technical collaboration across analog/mixed-signal design, system architecture, RTL, verification, physical design, packaging, and test engineering.
• Oversee integration of key AMS components such as ADCs, DACs, PLLs, voltage regulators, and sensor interfaces.
• Manage global cross-functional teams across time zones, ensuring alignment, accountability, and timely execution.
• Engage directly with executive management teams to communicate program status, risks, and strategic decisions.
• Serve as the primary interface for customer program management , ensuring expectations are met and feedback is incorporated.
• Apply data-driven project management practices to track KPIs, forecast risks, and optimize resource allocation.
• Coordinate with external IP vendors, foundries, OSATs, and EDA tool providers to manage dependencies and mitigate risks.
• Track program milestones, resource allocation, and risk mitigation plans using industry-standard tools.

Qualifications

• Bachelor's or master's degree in electrical engineering, Computer Engineering, or related field.
• 15+ years of experience in ASIC/SoC development and technical program management.
• Proven experience managing complex AMS programs and delivering PMIC-integrated ASICs to production.
• Demonstrated success in executive stakeholder engagement , customer-facing program leadership , and global team management .
• Strong proficiency in data-driven project tracking , including dashboards, metrics, and predictive analytics.
• Familiarity with silicon packaging technologies (e.g., QFN, BGA, MCM, 2.5D/3D stacking), mixed-signal design flows, and high-speed interfaces.
• Strong project management skills with proficiency in tools like MS Project, Jira, Confluence, and data visualization platforms.
• Excellent communication, leadership, and organizational skills.

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